BDN09-3CB/A01 datasheet
Mismong para sa BDN09-3CB/A01
Bilang bahagi : BDN09-3CB/A01
tagagawa : CTS Thermal Management Products
paglalarawan : HEATSINK CPU W/ADHESIVE .91SQ
serye : BDN
Katayuan ng Bahagi : Active
Uri : Top Mount
Pinalamig ang Pakete : Assorted (BGA, LGA, CPU, ASIC...)
Paraan ng Lakip : Thermal Tape, Adhesive (Included)
Hugis : Square, Pin Fins
Haba : 0.910" (23.11mm)
Lapad : 0.910" (23.11mm)
Diameter : -
Taas ng Base (Taas ng Fin) : 0.355" (9.02mm)
Power Dissipation @ temperatura ng Pagtaas : -
Thermal Resistance @ Sapilitang Air Flow : 9.60°C/W @ 400 LFM
Thermal Resistance @ Likas : 26.90°C/W
Materyal : Aluminum
Tapos na ang Materyal : Black Anodized
timbang : -
kalagayan : Bago at orihinal na
Garantisado ang kalidad : 365 araw na warranty
stock Resource : Franchised Distributor / Tagagawa Direct
Bansang pinagmulan : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Manufacturer Bilang Bahagi
Internal Bilang Bahagi
tagagawa
Maikling Paglalarawan
HEATSINK CPU W/ADHESIVE .91SQ
RoHS Status
Lead libreng / RoHS compliant
Oras ng paghatid
1-2 araw
magagamit na Dami
175125 piraso
reference Presyo
Ang aming Presyo
- (Mangyaring makipag-ugnay sa amin para sa isang mas mahusay na presyo: [email protected])
- AXE Semiconductor kung BDN09-3CB/A01 sa stock para ibenta.
- Pagpapadala pagpipilian at pagpapadala ng oras:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Mga Pagpipilian sa Pagbabayad:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
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