BGM15LBA12E6327XTSA1 - MULTI CHIP MODULES

Manufacturer Bilang Bahagi

BGM15LBA12E6327XTSA1

Internal Bilang Bahagi

AX-BGM15LBA12E6327XTSA1

tagagawa

Infineon Technologies

Maikling Paglalarawan

MULTI CHIP MODULES

RoHS Status

Lead libreng / RoHS compliant

Oras ng paghatid

1-2 araw

magagamit na Dami

1052310 Pieces

reference Presyo

~~USD 0.266616~~

Ang aming Presyo

- (Mangyaring makipag-ugnay sa amin para sa isang mas mahusay na presyo: [email protected])

AXE Semiconductor kung BGM15LBA12E6327XTSA1 sa stock para ibenta.

Pagpapadala pagpipilian at pagpapadala ng oras:: DHL: 2-3 days.; FEDEX: 2-3 days.; UPS: 2-4 days.; TNT: 3-5 days.; EMS: 5-8 days.; Normal Post: 10-15 days.

Mga Pagpipilian sa Pagbabayad:: Paypal (Credit Card); Bank Transfer (Wire Transfer); Western Union; MoneyGram

Mismong para sa BGM15LBA12E6327XTSA1

Garantisado ang kalidad : 365 araw na warranty

stock Resource : Franchised Distributor / Tagagawa Direct

Bansang pinagmulan : USA / TAIWAN / MEXICO / MALAYSIA / PHI

Bilang bahagi : BGM15LBA12E6327XTSA1

tagagawa : Infineon Technologies

paglalarawan : MULTI CHIP MODULES

serye : -

Katayuan ng Bahagi : Active

Pamilya / Pamantayang RF : Bluetooth

Protocol : 802.11a/b/g/n, Bluetooth v4.0

Modulasyon : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM

Dalas : 703MHz ~ 960MHz

Rate ng data : 54Mbps

Kapangyarihan - Output : -4dBm

Pagkamapagdamdam : -

Mga Serial Interfaces : SPI, USB

Uri ng Antena : -

Gamit ang IC / Bahagi : -

Laki ng memorya : -

Boltahe - Supply : 1.7V ~ 3.1V

Kasalukuyang - Tumatanggap : -

Kasalukuyang - Paglilipat : -

Uri ng Pag-mount : Surface Mount

Temperatura ng pagpapatakbo : -40°C ~ 85°C

Pakete / Kaso : 12-UFQFN Exposed Pad

timbang : -

kalagayan : Bago at orihinal na

Mga Kaugnay na Link : BGM15L , BGM15LBA12

Mga dokumento para sa BGM15LBA12E6327XTSA1

datasheets : BGM15LBA12E6327XTSA1.pdf

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