BGM15LBA12E6327XTSA1 - MULTI CHIP MODULES
Manufacturer Bilang Bahagi
Internal Bilang Bahagi
tagagawa
Maikling Paglalarawan
MULTI CHIP MODULES
RoHS Status
Lead libreng / RoHS compliant
Oras ng paghatid
1-2 araw
magagamit na Dami
1052310 Pieces
reference Presyo
Ang aming Presyo
- (Mangyaring makipag-ugnay sa amin para sa isang mas mahusay na presyo: [email protected])
- AXE Semiconductor kung BGM15LBA12E6327XTSA1 sa stock para ibenta.
- Pagpapadala pagpipilian at pagpapadala ng oras:
- DHL: 2-3 days.
- FEDEX: 2-3 days.
- UPS: 2-4 days.
- TNT: 3-5 days.
- EMS: 5-8 days.
- Normal Post: 10-15 days.
- Mga Pagpipilian sa Pagbabayad:
- Paypal (Credit Card)
- Bank Transfer (Wire Transfer)
- Western Union
- MoneyGram
Mismong para sa BGM15LBA12E6327XTSA1
Garantisado ang kalidad :
365 araw na warranty
stock Resource :
Franchised Distributor / Tagagawa Direct
Bansang pinagmulan :
USA / TAIWAN / MEXICO / MALAYSIA / PHI
Bilang bahagi :
BGM15LBA12E6327XTSA1
tagagawa :
Infineon Technologies
paglalarawan :
MULTI CHIP MODULES
serye :
-
Katayuan ng Bahagi :
Active
Pamilya / Pamantayang RF :
Bluetooth
Protocol :
802.11a/b/g/n, Bluetooth v4.0
Modulasyon :
16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Dalas :
703MHz ~ 960MHz
Rate ng data :
54Mbps
Kapangyarihan - Output :
-4dBm
Pagkamapagdamdam :
-
Mga Serial Interfaces :
SPI, USB
Uri ng Antena :
-
Gamit ang IC / Bahagi :
-
Laki ng memorya :
-
Boltahe - Supply :
1.7V ~ 3.1V
Kasalukuyang - Tumatanggap :
-
Kasalukuyang - Paglilipat :
-
Uri ng Pag-mount :
Surface Mount
Temperatura ng pagpapatakbo :
-40°C ~ 85°C
Pakete / Kaso :
12-UFQFN Exposed Pad
timbang :
-
kalagayan :
Bago at orihinal na
Mga Kaugnay na Link :
BGM15L , BGM15LBA12
Mga dokumento para sa BGM15LBA12E6327XTSA1
datasheets :
BGM15LBA12E6327XTSA1.pdf
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