BGM12LBA9E6327XTSA1 - MULTI CHIP MODULES

Manufacturer Bilang Bahagi
Internal Bilang Bahagi
Maikling Paglalarawan
MULTI CHIP MODULES
RoHS Status
Lead libreng / RoHS compliant
Oras ng paghatid
1-2 araw
magagamit na Dami
1881710 Pieces
reference Presyo
USD 0.1491
Ang aming Presyo
- (Mangyaring makipag-ugnay sa amin para sa isang mas mahusay na presyo: [email protected])

AXE Semiconductor kung BGM12LBA9E6327XTSA1 sa stock para ibenta.
Pagpapadala pagpipilian at pagpapadala ng oras:
DHL: 2-3 days.
FEDEX: 2-3 days.
UPS: 2-4 days.
TNT: 3-5 days.
EMS: 5-8 days.
Normal Post: 10-15 days.
Mga Pagpipilian sa Pagbabayad:
Paypal (Credit Card)
Bank Transfer (Wire Transfer)
Western Union
MoneyGram

Mismong para sa BGM12LBA9E6327XTSA1

Garantisado ang kalidad : 365 araw na warranty
stock Resource : Franchised Distributor / Tagagawa Direct
Bansang pinagmulan : USA / TAIWAN / MEXICO / MALAYSIA / PHI
Bilang bahagi : BGM12LBA9E6327XTSA1
tagagawa : Infineon Technologies
paglalarawan : MULTI CHIP MODULES
serye : -
Katayuan ng Bahagi : Active
Pamilya / Pamantayang RF : Bluetooth
Protocol : 802.11a/b/g/n, Bluetooth v4.0
Modulasyon : 16QAM, 64QAM, 256QAM, DSSS, FHSS, OFDM
Dalas : 703MHz ~ 960MHz
Rate ng data : 54Mbps
Kapangyarihan - Output : -5dBm
Pagkamapagdamdam : -
Mga Serial Interfaces : SPI, USB
Uri ng Antena : -
Gamit ang IC / Bahagi : -
Laki ng memorya : -
Boltahe - Supply : 1.6V ~ 3.1V
Kasalukuyang - Tumatanggap : -
Kasalukuyang - Paglilipat : -
Uri ng Pag-mount : Surface Mount
Temperatura ng pagpapatakbo : -40°C ~ 85°C
Pakete / Kaso : -
timbang : -
kalagayan : Bago at orihinal na
Mga Kaugnay na Link : BGM12L , BGM12LBA9

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